Yuning Chen
Meta

Contacts:

Email: ychen372 [at] ucmerced.edu

I'm a machine learning research scientist at Meta, working on LLM + recommendation systems for large-scale ads conversion products. My recent works explore improving language embedding's (1) alignment with multi-funnel user intents, (2) end-to-end integration within ads ranking and delivery, (3) incorporation of reasoning and agentic architecture. I believe sequential modeling and semantic reasoning are the future for RecSys. Welcome to discuss!

I obtained my Ph.D. in Electrical Engineering and Computer Science (2025) at the University of California, Merced, advised by Prof. Wan Du. I received my B.E. in Software Engineering (2021) from Tsinghua University, advised by Prof. Mingsheng Long.

What's New

Dec 2025
AnyPro (anycast network config optimization) was accepted to NSDI 2026. See you in Renton!
Oct 2025
Serving in the Program Committee of MLSys 2026.
Oct 2025
SoilX (sample-efficient contrastive pretraining for wireless sensing) was accepted to SenSys 2026.
Oct 2025
I was selected as a Top Reviewer for NeurIPS 2025 and awarded a complementary registration. :)
Jul 2025
I was invited to serve as an Area Chair in KDD 2026.
May 2025
I passed my Ph.D. dissertation defense and start full-time working at Meta.
May 2024
MARLP (model predictive control with causal learning + Transformer) was accepted to KDD 2024.
Feb 2024
CloudEval-YAML (cloud config generation with LLM / CodeGen model) with LLM was accepted to MLSys 2024.

Professional Experiences

Meta 

Research Scientist, Meta
May. 2025 - Present, Bellevue, WA

ByteDance 

Software Engineer Intern, ByteDance
May. 2024 - Aug. 2024, San Jose, CA

Alibaba Cloud 

Research Intern, Alibaba Cloud U.S.
May. 2023 - Aug. 2023, Sunnyvale, CA

Publications (*: co-primary authors)

Full papers

Workshops, Posters and Demos

Services

  • Conference Area Chair: KDD'25-26.
  • Conference Program Committee / Reviewer: MLSys'26, NeurIPS'24-25 (Top Reviewer), ICLR'25-26, ICML'25, KDD'25, AISTATS'25-26, AAAI'26, MM'25, CIKM'24 TRAI, SenSys'23 Poster & Demo.
  • Journal Reviewer: IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), IEEE Transactions on Mobile Computing (TMC), Transactions on Machine Learning Research (TMLR), ACM Transactions on Sensor Networks (TOSN), IEEE Transactions on Network Science and Engineering (TNSE), ACM Transactions on Internet of Things (TIOT), IEEE Internet of Things Journal (IoTJ).
  • Artifact Evaluation Committee: MobiCom'24-25, MobiSys'24.